Calibration of a three-dimensional acquisition system

ABSTRACT

Embodiments of the present disclosure provide techniques and configurations for an optoelectronic three-dimensional object acquisition assembly configured to correct image distortions. In one instance, the assembly may comprise a first device configured to project a light pattern on an object at a determined angle; a second device configured to capture a first image of the object illuminated with the projected light pattern; a third device configured to capture a second image of the object; and a controller coupled to the first, second, and third devices and configured to reconstruct an image of the object from geometric parameters of the object obtained from the first image, and to correct distortions in the reconstructed image caused by a variation of the determined angle of the light pattern projection, based at least in part on the first and second images of the object. Other embodiments may be described and/or claimed.

FIELD

Embodiments of the present disclosure generally relate to the field ofopto-electronics, and more particularly, to calibration techniquesapplied to a three-dimensional acquisition system.

BACKGROUND

Calibration of an optoelectronic three-dimensional (3D) acquisition orreconstruction system is typically done at assembly time. Subsequentcalibrations of the system may be needed due to the system's deviationfrom initial calibration due to various external factors, such astemperature, humidity or barometric pressure changes, or displacement ofsensing and/or projecting devices included in the system. However, thesesubsequent calibrations may not always be performed when needed, forexample, in response to the distortions occurring in the acquisitionsystem due to external factors. Furthermore, these calibrations may haveto be done manually and may require using calibration objects with knowndimensions that may be used to correct the system for known measuresbetween given detectable features of the object.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be readily understood by the following detaileddescription in conjunction with the accompanying drawings. To facilitatethis description, like reference numerals designate like structuralelements. Embodiments are illustrated by way of example and not by wayof limitation in the figures of the accompanying drawings.

FIG. 1 schematically illustrates an example device for three-dimensional(3D) object acquisition and distortion compensation, in accordance withsome embodiments.

FIG. 2 is a diagram illustrating an example optoelectronic assembly for3D object acquisition and distortion compensation in operation, inaccordance with some embodiments.

FIG. 3 is a process flow diagram for operation of the exampleoptoelectronic assembly for 3D object acquisition and distortioncompensation as described in reference to FIGS. 1 and 2, in accordancewith some embodiments.

FIG. 4 schematically illustrates an example system that may be used topractice various embodiments described herein.

DETAILED DESCRIPTION

Embodiments of the present disclosure include techniques andconfigurations for optoelectronic assembly for 3D object acquisition anddistortion compensation.

In the following detailed description, reference is made to theaccompanying drawings which form a part hereof, wherein like numeralsdesignate like parts throughout, and in which are shown by way ofillustration embodiments in which the subject matter of the presentdisclosure may be practiced. It is to be understood that otherembodiments may be utilized and structural or logical changes may bemade without departing from the scope of the present disclosure.Therefore, the following detailed description is not to be taken in alimiting sense, and the scope of embodiments is defined by the appendedclaims and their equivalents.

For the purposes of the present disclosure, the phrase “A and/or B”means (A), (B), or (A and B). For the purposes of the presentdisclosure, the phrase “A, B, and/or C” means (A), (B), (C), (A and B),(A and C), (B and C), or (A, B and C).

The description may use perspective-based descriptions such astop/bottom, in/out, over/under, and the like. Such descriptions aremerely used to facilitate the discussion and are not intended torestrict the application of embodiments described herein to anyparticular orientation.

The description may use the phrases “in an embodiment,” or “inembodiments,” which may each refer to one or more of the same ordifferent embodiments. Furthermore, the terms “comprising,” “including,”“having,” and the like, as used with respect to embodiments of thepresent disclosure, are synonymous.

The term “coupled with,” along with its derivatives, may be used herein.“Coupled” may mean one or more of the following. “Coupled” may mean thattwo or more elements are in direct physical, electrical, or opticalcontact. However, “coupled” may also mean that two or more elementsindirectly contact each other, but yet still cooperate or interact witheach other, and may mean that one or more other elements are coupled orconnected between the elements that are said to be coupled with eachother. The term “directly coupled” may mean that two or more elementsare in direct contact.

FIG. 1 schematically illustrates an example device 100 for athree-dimensional (3D) object acquisition and distortion compensation inaccordance with some embodiments of the present disclosure. In someembodiments, the device 100 may include a 3D scanner, a 3D camera or anyother device configured for a 3D object acquisition. In someembodiments, as illustrated, the device 100 may include an imagecapturing device 102 (e.g., a digital camera) and a projector unit 104,such as a laser projector or laser scanner, having a number ofcomponents. In some embodiments, the digital camera 102 may comprise aninfrared (IR) camera, and the projector unit 104 may comprise an IRprojector.

The device 100 may further include laser arrangement that includes alaser source 106, such as a laser device configured to provide a laserbeam 120, coupled with a control module 108. The control module 108 maybe implemented as a software or hardware module, or a combinationthereof. The control module 108 may be configured to control (e.g.,modulate) an optical power of the laser beam 120 provided by the lasersource 106.

The laser arrangement may further include an optical lens 110. The lasersource 106 and the optical lens 110 may be configured so that modulatedlaser beam 120 may pass through the optical lens 110. The lens 110 maybe a lens configured to focus light which passes through on to a lineinstead of on to a point, in contrast to a spherical lens, for example.In some embodiments, the lens 110 may be a cylindrical lens.Accordingly, the lens 110 may be configured to transform the laser beam120 passing through the lens 110 into a laser line 122. For betterunderstanding of a spatial disposition of the laser line 122 note thatthe laser line 122 may be disposed on a plane that is perpendicular tothe plane of FIG. 1. Accordingly, the laser line 122 formed from thelaser beam 120 passing through the lens 110 is shown as perpendicular tothe plane of FIG. 1.

The laser line 122 may be received and deflected by a tiltable orrotatable mirror 112 of device 100, forming, during mirror tilting,multiple laser planes, such as ones indicated by numerals 124, 126, and128. In some embodiments, the mirror 112 may be amicro-electromechanical system (MEMS) scanning mirror. In someembodiments, a mirror surface of MEMS scanning mirror 112 may be made ofsilicon (Si), although in different materials providing requiredproperties related to scanning mirror reflection qualities may beutilized in various embodiments. In some embodiments, the mirror 112 maybe a single-axis mirror, while in other embodiments the mirror 112 maybe a two-axis MEMS scanning mirror or a two-mirror system. In someembodiments, the MEMS scanning mirror 112 may be configured to be atleast partially tiltable (rotatable) around the axis 114, in order todeflect the laser line 122 so as to produce light patterns 140 projectedby the mirror 112 to an object 142 and defined by the laser planes 124,126, 128. For example, the mirror 112 may be tiltable, as shown by 118,at least from its resting position indicated by the numeral 116 to aposition indicated by 112, in order to provide a scan angle that ensuresa desired dimension for the light patterns defined by the exit laserplanes 124, 126, 128. The axis 114 may be substantially parallel to thelaser line 122, and the MEMS scanning mirror 112 may be disposed withina plane that is perpendicular to the plane of FIG. 1 and may be tiltablearound the axis 114, as shown. Accordingly, the laser planes 124, 126,128 may also be substantially perpendicular to the plane of FIG. 1. Insome embodiments, the control module 108 may be configured to controlthe tilting of the MEMS scanning mirror 112.

It should be understood by one skilled in the art that the projectorunit 104 configured to project the light pattern 140 as described abovemay comprise a one-dimensional coded projector and the light patterns140 comprise one-dimensional coded light patterns, e.g., the patternsthat may be described by one-dimensional or linear codes. The lightpatterns 140 formed by the laser planes 124, 126, 128 on a surface ofthe object 142 may be received by the image capturing device 102 andsensed (e.g., read) by a sensor 130 of the image capturing device 102.Based on the readings of the multiple scans of the light patternsaccumulated during a sensing cycle of the sensor 130, the device 100 maybe configured to reconstruct the shape of the object 142.

In some embodiments, the device 100 may further include another imagecapturing device, such as digital camera 160. In some embodiments, thedigital camera 160 may have a resolution that is different than that ofthe digital camera 102. For example, the digital camera 102 may be amulti-chromatic camera, such as red, green, and blue (RGB) cameraconfigured to capture texture images of the object 140. The objectimages captured by the digital camera 160 may be used to identify imagedistortions, such as misalignment of the geometric parameters of theobject reconstructed using the images captured by camera 102, and tocompensate for the identified distortions, as described in greaterdetail below.

The device 100 may include the controller 150 that may be associatedwith the control module 108 described above. The controller 150 mayinclude a processor 132, coupled with a memory 134 configured to enablethe above-noted and other functionalities of the device 100. Forexample, the processor 132 may be configured with executableinstructions stored in the memory 134 to enable operations of a lasersource 106, control module 108, and the MEMS scanning mirror 112 asdescribed herein. The controller 150 may be configured to reconstructthe object 142 based on the images captured by the digital camera 102,for example, using epipolar geometry techniques or other techniques usedfor 3D image reconstruction. The controller 150 may be furtherconfigured to dynamically calibrate the device 100 to correctdistortions in the reconstructed image of the object 142 that may becaused, for example, by variations of the angle of the light patternprojection by the MEMS scanning mirror 112 that may be caused by variousexternal factors (e.g., barometric pressure, temperature, humidity, ordisplacement of the MEMS scanning mirror 112).

In some embodiments, the device 100 described herein may further includeadditional components. For example, the processor 132, the memory 134,and/or other components of the controller 150 may comport with aprocessor-based system that may be a part of, or include, the device100, in accordance with some embodiments. The memory 134 for oneembodiment may include any suitable volatile memory, such as suitableDynamic Random Access Memory (DRAM), for example.

In some embodiments, the memory 134 may include instructions that, whenexecuted on the processor 132, cause the device 100 to performoperations described herein. In some embodiments, the control module 108may be implemented as a software component stored, e.g., in the memory134 and configured to execute on the processor 132. In some embodiments,the control module 108 may be implemented as a combination of a softwareand hardware components. In some embodiments, the control module 108 mayinclude a hardware implementation.

The processor 132, memory 134, other components (not shown), imagecapturing device 102, and projector unit 104 may be coupled with one ormore interfaces (not shown) configured to facilitate informationexchange among the above-mentioned components. Communicationsinterface(s) (not shown) may provide an interface for the device 100 tocommunicate over one or more wired or wireless network(s) and/or withany other suitable device. In various embodiments, the device 100 may beincluded to or associated with, but is not limited to, a server, aworkstation, a desktop computing device, or a mobile computing device(e.g., a laptop computing device, a handheld computing device, ahandset, a tablet, a smartphone, a netbook, ultrabook, etc.).

In various embodiments, the device 100 may have more or less components,and/or different architectures. For example, in some embodiments, thedevice 100 may include one or more of a camera, a keyboard, display suchas a liquid crystal display (LCD) screen (including touch screendisplays), a touch screen controller, non-volatile memory port, antennaor multiple antennas, graphics chip, ASIC, speaker(s), a battery, anaudio codec, a video codec, a power amplifier, a global positioningsystem (GPS) device, a compass, an accelerometer, a gyroscope, and thelike. In various embodiments, the device 100 may have more or lesscomponents, and/or different architectures. In various embodiments,techniques and configurations described herein may be used in a varietyof systems that benefit from the principles described herein such asoptoelectronic, electro-optical, MEMS devices and systems, and the like.

In summary, the device 100 may comprise an optoelectronic assembly for3D object acquisition and distortion compensation that may include aprojector unit 104, a digital camera (e.g., IR camera) 102, anotherdigital camera (e.g., multi-chromatic camera) 160, and a controller 150configured to operate the device 100 according to the embodimentsdescribed herein. However, the above assembly configuration is describedfor illustration purposes only, and is should not be limiting to thepresent disclosure. Various configurations of an assembly for a 3Dobject acquisition may be used to implement the embodiments describedherein. For example, an assembly for a 3D object acquisition configuredto enable the reconstructed object distortion corrections may includethree digital cameras, two of which may be used to reconstruct a 3Dimage of an object, and the third camera (e.g. with a resolution that isdifferent than those of the two cameras) may be used to capture imagesof the object in order to identify image distortions in thereconstructed object and to compensate for identified distortions.

FIG. 2 is an example diagram 200 illustrating an example optoelectronicassembly for 3D object acquisition and distortion compensation inoperation, in accordance with some embodiments. As described above, theexample optoelectronic assembly for 3D object acquisition and distortioncompensation may include a camera 202 (e.g., IR camera) similar tocamera 102, a projector 204 (e.g., IR projector) similar to projectorunit 104, and another camera 260 (e.g., multi-chromatic camera such asRGB camera) similar to camera 160. As described above, in a differentconfiguration, the example optoelectronic assembly may include anotherimage capturing device (e.g., a camera) instead of the projector 204,which may be used for 3D object reconstruction along with the camera202. Accordingly, while the description below discusses an operation ofthe optoelectronic assembly including the devices 202, 204, and 260,embodiments of an optoelectronic assembly having a camera instead of theprojector 204 and configured to enable 3D object acquisition anddistortion compensation may also be contemplated.

In operation, the projector 204 may project light (e.g., one-dimensionalcoded light patterns) on an object 208. The camera 202 may captureobject 208 images, as described in reference to FIG. 1. Assume theprojector 204 (e.g., a projector mirror similar to MEMS scanning mirror112) is displaced, such as shifted, skewed, moved, or otherwise rotatedaway from its initial position (e.g., due to changes in barometricpressure, humidity, temperature, or mechanical damage). It will beappreciated that among the components 202 and 204, the projector 204 maybe most sensitive to external factors listed above. Accordingly, thisdocument addresses the problem of correcting distortions caused byaccidental displacement of the projector 204.

As a result of the displacement of the projector 204 (for example, dueto imprecise assembly of the system, thermal deformation, etc.) or theprojector components (in case of a MEMS projector, the angle swapped bythe mirror may change due to change in barometric pressure), aprojection angle variation δθ 212 may occur between an undistorteddirection of projector 204's projection 216 on the object 208 and actualdirection of projection 218 on the object 208. This angle variation δθ212 may result in a corresponding range shift δr 220 of the direction ofview of the camera 260 along the direction of view 224 of camera 202. Asshown, the range shift (displacement) δr 220 may be formed by amisalignment δφ 222 between the direction of view of the camera 260without the distortion correction 226 and the direction of view of thecamera 260 with the distortion correction 228. In other words, theactual direction of projection 218 of the projector 204 may point at aspot A (230) on the physical object 208, while the direction of view 226without distortion correction of the camera 260 may point at a spot B(232) on a phantom object 210, causing the displacement δr 220 andcorresponding distortion of the reconstructed object 210 due to thedisplacement δr 220.

Observing the same spot B 232 by means of an additional camera 260 (forexample, an RGB camera used for texture mapping in some embodiments), itis possible to estimate the misalignment δφ 222, which, in turn, mayallow a controller, for example, controller 150, to compute thedisplacement δr 220 and to compensate for the corresponding anglevariation δθ 212, thus compensating for a distortion caused by thechange of position of the projector 204. For example, the object 208image may be reconstructed, e.g., by applying epipolar geometry (orother 3D object reconstruction techniques providing geometric relationsbetween 3D objects and their projections on the 2D images) to the imagescaptured by the camera 202 of the object with the light patternprojected to it via the actual direction of projection 218. Due to theangle variation δθ 212 the reconstructed image may have distortions inthe reconstructed geometric parameters of the object 208. The image (orimages) of the object 208 may also be captured by the camera 260. Thegeometric parameters derived from these images may be compared with thegeometric parameters of the object in the reconstructed image and amismatch of corresponding features in the texture image and thereconstructed image may be determined. At least one corrective parameterto be used in the reconstructed image to compensate for the mismatch maybe calculated.

For example, the coordinates of an object captured by the camera 202 maybe expressed by the following projection in homogeneous (projective)coordinates, which maps a three-dimensional point in the 3D worldcoordinates (expressed as a four-dimensional vector in homogeneousrepresentation, the extra fourth dimension allowing to equivalentlyexpress points and directions):

$\begin{matrix}{\begin{bmatrix}X_{c} \\1\end{bmatrix} = {{\alpha\;{{K_{c}\begin{bmatrix}I & O\end{bmatrix}}\begin{bmatrix}X_{w} \\1\end{bmatrix}}} = {{\alpha\begin{bmatrix}K_{c} & O\end{bmatrix}}X}}} & {{Equation}\mspace{14mu} 1}\end{matrix}$

where

Xc is a set of two-dimensional coordinates of a given point on theobject derived from an image taken by camera 202 (e.g., IR camera); (2dimensional, ε

²) in IR-camera coordinate system,

Kc is a 3×3 IR-camera intrinsic matrix, which may be obtained from theIR-camera intrinsic calibration,

Xw is a set of three-dimensional world coordinates of a given point onthe object,

X is the homogenous four-dimensional representation of the worldcoordinates X=[X_(w), 1]^(T) of a given point on the object,

α is a global scalar scaling factor,

I is a 3×3 identity matrix, and

O is a 3×1 vector of zeros.

The 3×4 projection matrix K_(c)[I O]=[K_(c) O] maps the worldcoordinates of a given point on the object in homogeneous representationto the camera system of coordinates in homogeneous representation.

The coordinates of the object captured by camera 260 (e.g., RGB camera)may be obtained by a similar projection formula, where one has toaccount for a relative position of camera 260 w.r.t. camera 202(expressed as a rotation and translation):

$\begin{matrix}{\begin{bmatrix}X_{r} \\1\end{bmatrix} = {{\alpha\;{{K_{r}\begin{bmatrix}I & O\end{bmatrix}}\begin{bmatrix}R_{rc} & t_{rc} \\O & 1\end{bmatrix}}X} = {\alpha\;{QX}}}} & {{Equation}\mspace{14mu} 2}\end{matrix}$

where

-   -   Xr is a set of two-dimensional RGB-camera coordinates of a given        point on the object (2 dimensional, ε        ²),    -   K_(r) is a 3×3 RGB-camera intrinsic matrix,

$\quad\begin{bmatrix}R_{rc} & t_{rc} \\O & 1\end{bmatrix}$

-   -    is a 4×4 transformation expressed in homogeneous coordinates,        representing the geometric relation of the RGB texture camera        and the IR camera, comprising a 3×3 rotation matrix R_(rc), and        a 3×1 translation vector t_(rc),    -   X are the world coordinates (expressed in homogeneous        representation) of a given point on the object, and    -   Q is a 3×4 texture camera matrix (intrinsic and extrinsic).

Kr may be obtained from the RGB-camera intrinsic calibration, R_(rc),t_(rc) from extrinsic calibration, or computed knowing the relativeplacement of the two cameras in the system assembly.

Assuming that the projector 204 (e.g., IR projector) projects a patternthat changes in one direction (e.g. vertical or horizontalrectangular-shaped patterns of different width changing in time, whichform a binary code), it may be regarded as a one-dimensional camera, andexpressed using a similar projection formula:

$\begin{matrix}{\begin{bmatrix}x_{p} \\1\end{bmatrix} = {\alpha\; K_{p}{\quad{{\begin{bmatrix}R_{pc} & t_{pc} \\O & 1\end{bmatrix}X} = {\alpha\;{PX}}}}}} & {{Equation}\mspace{14mu} 3}\end{matrix}$where

-   -   x_(p) are projector coordinates of a given point on the object        (1 dimensional, ∝_(p)ε        ¹),    -   K_(p) is a 2×3 projector intrinsic matrix,

$\quad\begin{bmatrix}R_{pc} & t_{pc} \\O & 1\end{bmatrix}$

-   -    is a 3×4 projector transformation relative to the IR camera        expressed in homogeneous coordinates, comprising a 3×3 rotation        matrix R_(pc), and a 3×1 translation vector t_(pc), and    -   P is a 2×4 projector matrix (intrinsic and extrinsic).

The projector matrix may be calculated as follows:

$\begin{matrix}{P = \begin{bmatrix}p_{1}^{T} \\p_{2}^{T}\end{bmatrix}} & {{Equation}\mspace{14mu} 4}\end{matrix}$where p₁, p₂εR⁴, and

$\begin{matrix}{x_{p} = {\frac{p_{1}^{T}}{p_{2}^{T}}\frac{X}{X}}} & {{Equation}\mspace{14mu} 5}\end{matrix}$

Equation 5 can be rewritten as(p ₁ −x _(p) p ₂)^(T) X=0.  Equation 6

The P value may be known for a system from calibration, for example,when the system is assembled and leaves the production factory. However,due to external factors (barometric pressure, temperature, etc.,displacing the projector 204 or its components with respect to the IRcamera 202), the P value may vary such that Equation 6 may hold onlyapproximately, resulting in the projector distortion effect described inreference to FIG. 2.

In order to compensate for this effect, a scaling correction(compensation) parameter ρ may be determined such that the newcompensated projector coordinates ρx_(p) may satisfy Equation 6.

For example, for any point i on the object with coordinates X^(i) aglobal scale ρ may be determined that may satisfy(p ₁ −ρx _(p) ^(i) p ₂)^(T) X ^(i)=0  Equation 7

The corrected projector matrix may be calculated by scaling{tilde over (p)} ₂ =ρp ₂  Equation 8

Assuming that the RGB and IR cameras are positioned in such a way thatthey observe (approximately) the same view of the object (up to parallaxeffects), each pixel in the IR camera image I_(r) may be mapped to theRGB camera image I_(c) (for simplicity, assuming that it includes onechannel, e.g. R, G or B, or is converted to grayscale), by means of atexture mapping function (X_(r))=X_(c), acting as a “geometric warping”of the RGB camera image. Accordingly, I_(c)(U(X_(r))) may be alignedwith I_(r)(X_(r)), since in general the mapping is not restricted tointeger grid positions of the pixels, interpolation can be employed.

The function U=U_(ρ) implicitly depends on the projector correction(scaling) parameter ρ. Large projector distortion (equivalently, wrongp) may result in the misalignment of images I_(c)(U(X_(r))) andI_(r)(X_(r)). Having a set of corresponding points in the two images,the optimization problem over ρ may define that may align the images,e.g. in the sense of average misalignment at corresponding points:min_(ρ)Σ_(i) d(I _(c)(U _(ρ)(X _(r) ^(i))),I _(r)(X _(r)^(i)))  Equation 9

where d is a distance between the corresponding pixels, expressing thedegree of misalignment.

Optimization problem in Equation 9 may be solved, for example, by asearch over a set of pre-defined values of ρ in a range chosen accordingto the possible projector distortion, selecting the value that mayresult in the smallest misalignment.

FIG. 3 is a process flow diagram for operation of the exampleoptoelectronic assembly for 3D object acquisition and distortioncompensation as described in reference to FIGS. 1 and 2, in accordancewith some embodiments. Note that the process 300 does not have to beperformed in a sequence described below. Some of the operations may beperformed in parallel, and others may be performed in a different order,for example, blocks 304, 306, and 308 may be performed in parallel or ina different order. Accordingly, the process 300 is described asillustrative only and is not limiting to the present disclosure.

The process 300 may be triggered in a number of different ways. Forexample, the presence of distortions may be determined (e.g., by thecontroller 150) in the reconstructed object image. For example, thecontroller 150 may determine whether distortions of at least one of thereconstructed geometric parameters exceed a determined threshold. Insome embodiments, the presence of distortion(s) may be determinedexternally. For example, the presence of distortions may be handled by adevice component associated with the controller 150, e.g., softwarecomponent configured to perform, for example, gesture tracking andanalysis. If the performance of gesture tracking drops below a certainlevel (for example, the confidence of hand detection is determined to bebelow a pre-determined threshold), the controller 150 may trigger thedistortion correction process 300 described below.

Additionally or alternatively, in some embodiments, the distortioncorrection process 300 may occur every time the example optoelectronicassembly or its components (e.g., camera) are turned on, orperiodically, e.g., at every fixed time interval.

In some embodiments, the controller 150 may be configured to initiatedistortion correction based on detecting that at least one of externalparameters, such as barometric pressure, temperature, or humidity hasexceeded a determined threshold. In some embodiments, the controller 150may be configured to initiate distortion correction based on detectingthat the projection angle of the projector 104 (204) has changed and thechange exceeded a determined angle change threshold.

The process 300 may begin at block 302, where a projector unit (e.g.,projector 104 or 204) may project light patterns on an object. Forexample, the project unit may illuminate the object by a sequence oflight patterns as described in reference to FIG. 1.

At block 304, an image (first image) of the object may be obtained witha first camera (e.g., camera 102 or 202). The object image geometricparameters may be reconstructed (e.g., by the controller 150) usingvarious techniques, such as epipolar geometry as described above.

At block 306, another (second) image of the object may be obtained witha second camera (e.g., camera 160 or 260).

At block 308, misalignment between the first and second images may bedetermined e.g. according to Equation 9.

At block 310, distortion compensation parameter(s) may be determined tominimize misalignment between the images, as described in reference toFIG. 2.

At block 312, the controller 150 may initiate a correction ofdistortions in the reconstructed object image (e.g., first image), basedon comparing first and second images taken by the cameras 102 (202) and160 (260), as described above.

In summary, the controller 150 may correct distortions in thereconstructed geometric parameters by comparing the second image withthe first (reconstructed) image, determining and estimating amisalignment (mismatch) of corresponding features in the second imageand the reconstructed image, and identifying at least one compensationparameter to be used in the reconstructed image to compensate for themisalignment (mismatch) as described in reference to FIG. 2.

FIG. 4 schematically illustrates an example system that may be used topractice various embodiments described herein. More specifically, theexample system of FIG. 4 may include an optoelectronic assembly for 3Dobject acquisition and distortion compensation as described in referenceto FIGS. 1-3.

FIG. 4 illustrates, for one embodiment, an example system 400 having oneor more processor(s) 404, system control module 408 coupled to at leastone of the processor(s) 404, system memory 412 coupled to system controlmodule 408, non-volatile memory (NVM)/storage 414 coupled to systemcontrol module 408, and one or more communications interface(s) 420coupled to system control module 408. In some embodiments, the system400 may include a device 100 or optoelectronic assembly 200 and providelogic/module that performs functions aimed at correcting distortions ina reconstructed object image described herein.

In some embodiments, the system 400 may include one or morecomputer-readable media (e.g., system memory or NVM/storage 414) havinginstructions and one or more processors (e.g., processor(s) 404) coupledwith the one or more computer-readable media and configured to executethe instructions to implement a module to perform image distortioncorrection calculation actions described herein.

System control module 408 for one embodiment may include any suitableinterface controllers to provide for any suitable interface to at leastone of the processor(s) 404 and/or to any suitable device or componentin communication with system control module 408.

System control module 408 may include memory controller module 410 toprovide an interface to system memory 412. The memory controller module410 may be a hardware module, a software module, and/or a firmwaremodule. System memory 412 may be used to load and store data and/orinstructions, for example, for system 400. System memory 412 for oneembodiment may include any suitable volatile memory, such as suitableDRAM, for example. System control module 408 for one embodiment mayinclude one or more input/output (I/O) controller(s) to provide aninterface to NVM/storage 414 and communications interface(s) 420.

The NVM/storage 414 may be used to store data and/or instructions, forexample. NVM/storage 414 may include any suitable non-volatile memory,such as flash memory, for example, and/or may include any suitablenon-volatile storage device(s), such as one or more hard disk drive(s)(HDD(s)), one or more compact disc (CD) drive(s), and/or one or moredigital versatile disc (DVD) drive(s), for example. The NVM/storage 414may include a storage resource physically part of a device on which thesystem 400 is installed or it may be accessible by, but not necessarilya part of, the device. For example, the NVM/storage 414 may be accessedover a network via the communications interface(s) 420.

Communications interface(s) 420 may provide an interface for system 400to communicate over one or more network(s) and/or with any othersuitable device. The system 400 may wirelessly communicate with the oneor more components of the wireless network in accordance with any of oneor more wireless network standards and/or protocols.

For one embodiment, at least one of the processor(s) 404 may be packagedtogether with logic for one or more controller(s) of system controlmodule 408, e.g., memory controller module 410. For one embodiment, atleast one of the processor(s) 404 may be packaged together with logicfor one or more controllers of system control module 408 to form aSystem in Package (SiP). For one embodiment, at least one of theprocessor(s) 404 may be integrated on the same die with logic for one ormore controller(s) of system control module 408. For one embodiment, atleast one of the processor(s) 404 may be integrated on the same die withlogic for one or more controller(s) of system control module 408 to forma System on Chip (SoC).

In various embodiments, the system 400 may have more or less components,and/or different architectures. For example, in some embodiments, thesystem 400 may include one or more of a camera, a keyboard, liquidcrystal display (LCD) screen (including touch screen displays),non-volatile memory port, multiple antennas, graphics chip,application-specific integrated circuit (ASIC), and speakers.

In various implementations, the system 400 may be, but is not limitedto, a mobile computing device (e.g., a laptop computing device, ahandheld computing device, a tablet, a netbook, etc.), a laptop, anetbook, a notebook, an ultrabook, a smartphone, a tablet, a personaldigital assistant (PDA), an ultra mobile PC, a mobile phone, a desktopcomputer, a server, a printer, a scanner, a monitor, a set-top box, anentertainment control unit, a digital camera, a portable music player,or a digital video recorder. In further implementations, the system 400may be any other electronic device.

The embodiments described herein may be further illustrated by thefollowing examples. Example 1 is an optoelectronic three-dimensionalobject acquisition assembly for correcting distortions in areconstructed image of an object, comprising: a first device configuredto project light patterns on an object; a second device configured tocapture a first image of the object illuminated with the projected lightpatterns; a third device configured to capture a second image of theobject illuminated with the projected light patterns; and a controllercoupled to the first, second, and third devices and configured toreconstruct an image of the object from geometric parameters of theobject obtained from the first image, and further configured to correctdistortions in the reconstructed image caused by a variation of adetermined angle of the light patterns projection by the first device,based at least in part on the first and second images of the object.

Example 2 may include the subject matter of Example 1, and furtherspecifies that the first device comprises a projector configured toproject one-dimensional coded light patterns on the object.

Example 3 may include the subject matter of Example 2, and furtherspecifies that the projector includes at least onemicro-electro-mechanical systems (MEMS) mirror configured to reflect alaser line generated by a laser arrangement coupled with the projector,during pre-determined time intervals, to project the one-dimensionalcoded light patterns resulted from the tiltable reflection.

Example 4 may include the subject matter of Example 3, and furtherspecifies that the second device comprises a digital IR cameraconfigured to capture the second image during a sensing cycle of thedigital IR camera.

Example 5 may include the subject matter of Example 4, and furtherspecifies that the third device comprises a digital camera having aresolution that is different than a resolution of the second device andconfigured to capture a texture image of the object in the second image.

Example 6 may include the subject matter of Example 5, and furtherspecifies that the first device comprises an infrared (IR) projector,the second device comprises an IR camera, and the third device comprisesmulti-chromatic camera, including a red, green, and blue (RGB) camera.

Example 7 may include the subject matter of Example 5, and furtherspecifies that the controller is configured to correct distortions inthe reconstructed geometric parameters by comparing the texture imagewith the reconstructed image, determining a mismatch of correspondingfeatures in the texture image and the reconstructed image, andidentifying at least one correction parameter to be used in thereconstructed image to compensate for the mismatch.

Example 8 may include the subject matter of Example 7, and furtherspecifies that the controller is further configured to estimate amisalignment in the texture image caused by the variation of thedetermined angle of the light pattern projection, compute a displacementof the geometric parameters of the reconstructed image of the objectcaused by the misalignment, and compensate the reconstructed geometricparameters for the computed displacement.

Example 9 may include the subject matter of Example 1, and furtherspecifies that the controller is further configured to correctdistortions in the reconstructed image periodically.

Example 10 may include the subject matter of Example 1, and furtherspecifies that the controller is further configured to initiate acorrection of distortions in the reconstructed image in response to adetermination that a distortion of at least one of the geometricparameters exceeds a determined threshold.

Example 11 may include the subject matter of any of Examples 1 to 10,and further specifies that the distortions are caused by at least oneof: a change of barometric pressure, temperature, or humidity, ordisplacement of the first device.

Example 12 is an optoelectronic three-dimensional object acquisitionassembly for correcting distortions in a reconstructed image of anobject, comprising: a first device configured to capture a first imageof an object; a second device configured to capture a second image ofthe object; a third device configured to capture a third image of theobject; and a controller coupled to the first, second, and third devicesand configured to reconstruct an image of the object from geometricparameters of the object obtained from the first and second images, andfurther configured to correct distortions in the reconstructed imagecaused by a displacement of the first device, based at least in part onthe first, second, and third images of the object.

Example 13 may include the subject matter of Example 12, and furtherspecifies that the first and second devices comprise digital infrared(IR) camera configured to capture the first and second images duringrespective sensing cycles of the digital IR cameras.

Example 14 may include the subject matter of Example 12, and furtherspecifies that the third device comprises a multi-chromatic camerahaving a resolution that is different than a resolution of the seconddevice and configured to capture a pre-calibrated texture image of theobject in the second image.

Example 15 may include the subject matter of Example 12, and furtherspecifies that the controller is configured to obtain the geometricparameters of the object using epipolar geometry techniques.

Example 16 may include the subject matter of any of Examples 12 to 15,and further specifies that the controller is further configured tocorrect distortions in the reconstructed image of the object by aligningthe reconstructed image of the with the third image and determining amismatch of corresponding features in the reconstructed image and thethird image.

Example 17 is a method for correcting distortions in a reconstructedimage of an object, comprising: obtaining, by a controller coupled witha three-dimensional object acquisition assembly, a first image of anobject captured with a first camera included in the three-dimensionalobject acquisition assembly, the image captured during a projection of alight pattern on the object at a determined angle with a projectorincluded in the three-dimensional object acquisition assembly;obtaining, by the controller, a second image of the object captured witha second camera included in a three-dimensional object acquisitionassembly; and reconstructing, by the controller, an image of the objectfrom geometric parameters of the object obtained from the first image,wherein the reconstructing includes correcting, by the controller,distortions in the reconstructed image based at least in part on thefirst and second images of the object, the distortions caused by avariation of the determined angle of the light pattern projection by theprojector.

Example 18 may include the subject matter of Example 17, and furtherspecifies that the method further comprises: first determining, by thecontroller, whether distortions of at least one of the geometricparameters exceed a determined threshold; and second determining, by thecontroller, to initiate the correcting distortions based on a result offirst determining.

Example 19 may include the subject matter of Example 17, and furtherspecifies that the projector comprises an infrared (IR) projector, thefirst camera comprises an IR digital camera, and the second cameracomprises a multi-chromatic camera, including a digital red, green, andblue (RGB) camera.

Example 20 may include the subject matter of any of Examples 17 to 19,and further specifies that the correcting distortions in thereconstructed image includes: comparing, by the controller, thereconstructed image with the second image; determining, by thecontroller, a mismatch of corresponding features in the reconstructedimage and the second image; and identifying, by the controller, at leastone correction parameter to be used in the reconstructed image tocompensate for the mismatch.

Various operations are described as multiple discrete operations inturn, in a manner that is most helpful in understanding the claimedsubject matter. However, the order of description should not beconstrued as to imply that these operations are necessarily orderdependent. Embodiments of the present disclosure may be implemented intoa system using any suitable hardware and/or software to configure asdesired.

Although certain embodiments have been illustrated and described hereinfor purposes of description, a wide variety of alternate and/orequivalent embodiments or implementations calculated to achieve the samepurposes may be substituted for the embodiments shown and describedwithout departing from the scope of the present disclosure. Thisapplication is intended to cover any adaptations or variations of theembodiments discussed herein. Therefore, it is manifestly intended thatembodiments described herein be limited only by the claims and theequivalents thereof.

What is claimed is:
 1. An optoelectronic three-dimensional objectacquisition assembly, comprising: a first device to project lightpatterns on an object; a second device to capture a first image of theobject illuminated with the projected light patterns; a third device tocapture a second image of the object illuminated with the projectedlight patterns; and a controller coupled to the first, second, and thirddevices, to reconstruct an image of the object from geometric parametersof the object obtained from the first image, and further to correctdistortions in the reconstructed image caused by a variation of adetermined angle of the light patterns projection by the first device,based at least in part on the first and second images of the object, inresponse to a determination that a distortion of at least one of thegeometric parameters obtained from the first image exceeds a determinedthreshold.
 2. The assembly of claim 1, wherein the first devicecomprises a projector to project one-dimensional coded light patterns onthe object.
 3. The assembly of claim 2, wherein the projector includesat least one micro-electro-mechanical systems (MEMS) mirror to reflect alaser line generated by a laser arrangement coupled with the projector,during pre-determined time intervals, to project the one-dimensionalcoded light patterns resulted from a tiltable reflection.
 4. Theassembly of claim 3, wherein the second device comprises a digital IRcamera to capture the second image during a sensing cycle of the digitalIR camera.
 5. The assembly of claim 4, wherein the third devicecomprises a digital camera having a resolution that is different than aresolution of the second device, to capture a texture image of theobject in the second image.
 6. The assembly of clam 5, wherein the firstdevice comprises an infrared (IR) projector, the second device comprisesan IR camera, and the third device comprises multi-chromatic camera,including a red, green, and blue (RGB) camera.
 7. The assembly of clam5, wherein the controller is to correct distortions in the reconstructedgeometric parameters by comparison of the texture image with thereconstructed image, determination of a mismatch of correspondingfeatures in the texture image and the reconstructed image, andidentification of at least one correction parameter to be used in thereconstructed image to compensate for the mismatch.
 8. The assembly ofclaim 7, wherein the controller is further to estimate a misalignment inthe texture image caused by the variation of the determined angle of thelight pattern projection, compute a displacement of the geometricparameters of the reconstructed image of the object caused by themisalignment, and compensate the reconstructed geometric parameters forthe computed displacement.
 9. The assembly of claim 1, wherein thecontroller is further to correct distortions in the reconstructed imageperiodically.
 10. The assembly of claim 1, wherein the distortions arecaused by at least one of: a change of barometric pressure, temperature,or humidity, or displacement of the first device.
 11. An optoelectronicthree-dimensional object acquisition assembly, comprising: a firstdevice to capture a first image of an object; a second device to capturea second image of the object; a third device to capture a third image ofthe object; and a controller coupled to the first, second, and thirddevices, to reconstruct an image of the object from geometric parametersof the object obtained from the first and second images, and further tocorrect distortions in the reconstructed image caused by a displacementof the first device, based at least in part on the first, second, andthird images of the object, in response to a determination that adistortion of at least one of the geometric parameters obtained from thefirst image exceeds a determined threshold.
 12. The assembly of claim11, wherein the first and second devices comprise a digital infrared(IR) camera to capture the first and second images during respectivesensing cycles of the digital IR cameras.
 13. The assembly of clam 11,wherein the third device comprises a multi-chromatic camera having aresolution that is different than a resolution of the second device, tocapture a pre-calibrated texture image of the object in the secondimage.
 14. The assembly of claim 11, wherein the controller is to obtainthe geometric parameters of the object using epipolar geometrytechniques.
 15. The assembly of claim 11, wherein the controller isfurther to correct distortions in the reconstructed image of the objectthrough alignment of the reconstructed image with the third image anddetermination of a mismatch of corresponding features in thereconstructed image and the third image.
 16. A method for correctingdistortions in a reconstructed image of an object, comprising:obtaining, by a controller coupled with a three-dimensional objectacquisition assembly, a first image of an object captured with a firstcamera included in the three-dimensional object acquisition assembly,the image captured during a projection of a light pattern on the objectat a determined angle with a projector included in the three-dimensionalobject acquisition assembly; obtaining, by the controller, a secondimage of the object captured with a second camera included in athree-dimensional object acquisition assembly; and reconstructing, bythe controller, an image of the object from geometric parameters of theobject obtained from the first image, wherein the reconstructingincludes: determining, by the controller, whether distortions of atleast one of the geometric parameters exceed a determined threshold; andcorrecting, by the controller, distortions in the reconstructed imagebased at least in part on a result of the determining, the distortionscaused by a variation of the determined angle of the light patternprojection by the projector.
 17. The method of claim 16, wherein theprojector comprises an infrared (IR) projector, the first cameracomprises an IR digital camera, and the second camera comprises amulti-chromatic camera, including a digital red, green, and blue (RGB)camera.
 18. The method of claim 16, wherein the correcting distortionsin the reconstructed image includes: comparing, by the controller, thereconstructed image with the second image; determining, by thecontroller, a mismatch of corresponding features in the reconstructedimage and the second image; and identifying, by the controller, at leastone correction parameter to be used in the reconstructed image tocompensate for the mismatch.